Shenzhen Betterliv Technology Co., Ltd.
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OEM Power Bank PCBA Electrical Circuit Board Power Supply Module Design PCBA
Product Details
| PCB assembly Layers | 1 Layers to 20 layer (standard, including HDI board ) |
| PCB assembly material/type | FR4, Aluminum, CEM1, Supper-thin PCB, FPC/Gold finger |
| PCB Assembly service type | DIP/SMD or Mixed SMD & DIP |
| Base material thickness | 0.2-3.6mm |
| Copper thickness | 18um(H/HOZ),35um(1/1OZ),70um(2/2OZ),5OZ |
| Assembly surface finish | Gold-plated, HASL,OSP, ENIG |
| PCB Dimension (max) | 500*700mm |
| IC Pitch(min) | 0.2mm |
| Chip size(min) | 01005 |
| Drilled hole size(min) | 0.075mm |
| Track width/spacing(min) | 3mil |
| IC Encapsulation type | SOP/CSP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA |
| Outline tolerance | ±0.1mm |
| Hole diameter tolerance | ±0.076mm |
| Hole location tolerance | ±0.076mm |
| V-CUT tolerance | ±0.1mm |
PCB/PCBA capability and services
1. Singlesided PCB, double side PCB & multilayer PCB with competitive price, good quality and excellent service.
2. FR-4, FR-4 High TG, CEM-1, CEM-3, Aluminum base material.
3. HAL, HAL lead free, Immersion Gold/ Silver/Tin, OSP surface treatment.
4. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
5. Quantities range from prototype to medium and batch production.