Shenzhen Betterliv Technology Co., Ltd.
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8 Layer FR4 Electronic Multilayer PCB Circuit Board Fabrication Flex-Rigid ISO9001 Electronics PCBA Assembly RoHS PCB
PCB Technical Capability
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Layers
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Mass production: 2~58 layers / Pilot run: 64 layers
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Max. Thickness
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Mass production: 394mil (10mm) / Pilot run: 17.5mm
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Material
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FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, etc.
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Min. Width/Spacing
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Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)
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Max. Copper Thickness
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UL certificated: 6.0 OZ / Pilot run: 12OZ
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Min. Hole Size
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Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)
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Max. Panel Size
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1150mm × 560mm
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Inner layer: 3mil/3mil(HOZ), Outer layer: 4mil/4mil (1OZ)
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Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)
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Aspect Ratio
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18:1
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Surface Finish
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UL certificated: 6.0 OZ / Pilot run: 12OZ
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Special Process
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Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control.
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Our service
*Electronic components material purchasing
*Bare PCB fabrication
*PCB Assembly Service. (SMT, DIP)
*FULL Test: AOI, X-Ray, In-Circuit Test (ICT), Functional Test (FCT)
*Prototyping and mass production...
*PCB layout, PCBA design according to your idea
Advantages
*R&D team support
*UL, RoHS,ISO9001
*Advanced production line and promtly delivery.
*Honest Credibility in China.
*Professional and abundant experience in PCB.
*Competitive price and good quality.
*Excellent after-sales service.