Shenzhen Betterliv Technology Co., Ltd.
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Fast Custom 6 Layers HDI Buried Blind Vias Hole PCB Quick Turn PCB Assembly For Eelectrical Products
PCB Manufacture Capability
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Layers
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6 Layers
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Material
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FR4 TG130
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Copper thichness
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1oz
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Board thickness
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1.6mm
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Min. Hole Size
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0.3mm
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Min. Line Width
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8mil
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Min. Line Spacing
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8mil
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Surface Finish
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ENIG
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S/M Color
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Blue
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Special Process
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HDI, BVH, back drill, pressfit hole, edge plating, VOP, counter sunk, half hole, gold plating, gold finger, ENIG+OSP, flex board, rigid-flex board
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Our service
We are manufacturer, specializing in PCB and PCBA R&D and production.
• Electronic components material purchasing
• Bare PCB fabrication
• PCB Assembly Service. (SMT, DIP)
• FULL Test: AOI, X-Ray, In-Circuit Test (ICT), Functional Test (FCT)
• Conformal coating service
• Prototyping and mass production...
• PCB layout, PCBA design according to your idea